モバイル機器用PoPでルネサスが新提案、SoCをパッケージ基板に内蔵してコスト低減 | 日経クロステック（xTECH）
Table I from Package-on-Package (PoP) warpage characteristic and requirement | Semantic Scholar
The Benefits of Package-on-Package Assembly | ACME PCB ASSEMBLY
![Eng Sub] PoP(Package on Package): Qualcomm, Apple, Samsung - MCeP, InFO, iPoP - YouTube](https://i.ytimg.com/vi/FU62n4S9VEk/maxresdefault.jpg "Eng Sub] PoP(Package on Package): Qualcomm, Apple, Samsung - MCeP, InFO, iPoP - YouTube")
Eng Sub] PoP(Package on Package): Qualcomm, Apple, Samsung - MCeP, InFO, iPoP - YouTube
integrated circuit - Package on package and Flip chip what is the difference? - Electrical Engineering Stack Exchange
Figure 1 from Thermal characterization of package-on-package (POP) | Semantic Scholar
Surface Mount Assembly Procedure of PoP Components | PCBCart
POP (Package on Package) テストソケット - Maclane Inc.
POP -Package on Package (PoP) Assembly on PCB | MADPCB
Escatec invests in Package-on-Package capability | ECN Europe
A Word on Packaging & Looking Forward - The Apple iPad Review (2012)
Assembly Guidelines for 0.5mm Package-on-Package (PoP) Apps Processors, Part II
Definition of package on package | PCMag
Package On Package (PoP) | Advanced Packaging | CAPLINQ
Package-on-Package (PoP)
Package-on-Package | Applications | Indium Corporation
InFO (Integrated Fan-Out) Wafer Level Packaging - 台湾セミコンダクター・マニュファクチャリング・カンパニー (TSMC)
Surface Mount Assembly Procedure of PoP Components | PCBCart
Package on a package - Wikipedia
Package-on-Package (POP)
Package-on-Package | Applications | Indium Corporation
Package on Package (POP, PSVFBGA) Dummy Component-Amkor
モバイル機器用PoPでルネサスが新提案、SoCをパッケージ基板に内蔵してコスト低減 | 日経クロステック（xTECH）
Package On Package (PoP) - YouTube
POP(Package on package), How to place IC on IC. - YouTube
Mistral Blog: Understanding the concept of PoP technology
Effect of package thermal warpage for POP assembling technique | Semantic Scholar
Package-on-Package (PoP)
